European Sovereignty Monitor

Compute and infrastructure

France's Lightspring raises EUR 3.5 million seed to fix photonic chip packaging

Besançon based Lightspring raised EUR 3.5 million (a EUR 3.1 million seed round led by Atlantic and OVNI Capital plus a EUR 350,000 i-Lab grant) to industrialise 3D printed optical packaging for photonic chips used in AI infrastructure.

Reported AI-drafted Tech.eu, 22 September 2026

What it does not test. This does not show the packaging process has reached volume manufacturing or displaced any non-European supplier.

How this item counts. Towards autonomy: it changes who made the parts. Binding 2 of 3 (agreed or funded), scale 1 of 3 (small), Reported counts half: weight +1 of 36 possible. EUR3.5m seed funds French photonic packaging maker, single-firm scale. European Sovereignty Index

How this item was made. Drafted by an AI system (Claude (Anthropic)) from the source cited above and published under the editor’s responsibility without a person reading it first. How the record is made

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