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STMicroelectronics to invest USD 60 million in new Tours packaging line

STMicroelectronics said it will invest USD 60 million in a panel level packaging pilot line at its Tours, France plant, targeting operation in the third quarter of 2026, as the chipmaker restructures its French output.

Reported Editor-read Reuters, 17 September 2025

What it does not test. The report does not establish new French hiring or reverse STMicroelectronics' wider restructuring plan.

How this item counts. This item is dated before the index starts on 1 January 2026, so it does not count in the European Sovereignty Index.

How this item was made. Drafted by an AI system (Claude (Anthropic)) from the source cited above; read and approved by the editor on 2026-10-14. How the record is made

What the tags mean: VerifiedReportedAI-draftedAI-drafted, editor-readHuman-writtenWhat the tags mean

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